国家/地区 中国（2）
IPC部 E（2）
IPC大类 E04（2） F24（2）
IPC小类 E04F（2）
IPC E04F015/02（2） F24D013/02（2）
发明人
公开年 2022（2）
申请年 2020（2）
专利权人

Low temperature radiation heating floor structure, has honeycomb structure unit composed of circular holes on four nodes whose cross section is rhombic hole, and plane distributed on hole, where hole is filled with graphene conductive material.

MU J

High temperature resistant substrate graphene heating plate, has middle plate whose bottom is provided with substrate, where bottom of substrate is formed with heat insulating layer, and bottom of insulator layer is formed in moisture-proof layer.

DENG H, REN X