▎ 摘　　要

Graphene known for its superb physical properties, such as high transparency and thermal conductivity, is proposed as a solution to the problem of thermal management of the electronic devices, requiring transparency and cooling. It is shown that graphene heat spreader layer drives the heat out of the device more efficiently as compared with the commercially used metal thin films for integrated circuit cooling. An application of graphene heat spreader is proposed and tested in chip-on-film packaging. Graphene performance is compared with a gold layer with a similar transparency experimentally and theoretically as a proof of the efficient thermal management capability of graphene.