• 文献标题:   Laser-oxidized Fe3O4 nanoparticles anchored on 3D macroporous graphene flexible electrodes for ultrahigh-energy in-plane hybrid micro-supercapacitors
  • 文献类型:   Article
  • 作  者:   LIU HL, MOON KS, LI JX, XIE YX, LIU JB, SUN ZJ, LU LS, TANG Y, WONG CP
  • 作者关键词:   laser deposition, capillary effect, iron rim oxide, laserinduced graphene, flexible, hybrid microsupercapacitor
  • 出版物名称:   NANO ENERGY
  • ISSN:   2211-2855 EI 2211-3282
  • 通讯作者地址:   South China Univ Technol
  • 被引频次:   0
  • DOI:   10.1016/j.nanoen.2020.105058
  • 出版年:   2020

▎ 摘  要

Flexible battery-type in-plane hybrid micro-supercapacitors (IHMSCs), which combine fast charging rate of micro-supercapacitors and high energy density of batteries, provide great potentials for flexible microdevices. However, their low-efficiency, high-cost process and limited energy density still hinder their practical applications. Herein, we report the high-efficient fabrication of Fe3O4 nanoparticle-anchored laser-induced graphene (LIG/Fe3O4) with hierarchical porous structures on a flexible substrate wherein aggregated Fe3O4 nanoparticles (similar to 24.08 nm) with mesopores are self-deposited onto macroporous LIG scaffolds by laser in one step. The unique 3D structures in LIG/Fe3O4 give rise to superhydrophilic and capillary effects with a pumping capacity of up to 0.096 mu m in water, resulting in continuous superior wettability between electrodes and water-based electrolyte. Benefiting from the reversible H+ ion (de)intercalation reaction with Fe3O4 nanoparticles, the resulting IHMSCs based on LIG/Fe3O4 as the anode and LIG as the cathode deliver an ultrahigh areal capacitance of 719.28 mF/cm(2), which is over 100 times higher than that of LIG micro-supercapacitors, and an areal energy density of 60.20 mu Wh/cm(2), superior to those of most previously reported IHMSCs. Furthermore, the IHMSCs exhibit a good cycling stability and mechanical flexibility. Our method is applicable to other capillary-functionalized flexible electronics and may open new avenues for large-scale industrial fabrication of flexible electronics.