• 文献标题:   Impact of bonding energy on thermal conductance of metal/graphene/metal interfaces
  • 文献类型:   Article
  • 作  者:   ZHANG CW, ZHOU H, XIA SW, ZENG Y, ZHAN YL, ZOU AH, WEI Z, BI KD
  • 作者关键词:   bond energy, thermal conductance of interface, molecular dynamics simulation, metal/graphene/metal
  • 出版物名称:   MATERIALS RESEARCH EXPRESS
  • ISSN:   2053-1591
  • 通讯作者地址:   Yancheng Inst Technol
  • 被引频次:   0
  • DOI:   10.1088/2053-1591/ab185a
  • 出版年:   2019

▎ 摘  要

The thermal conductance at the interface between graphene and other metals is an important issue for graphene-based applications in the near future. The non-equilibrium molecular dynamics simulation is performed to investigate the effects of bonding energy between graphene and metal films on the metal/graphene/metal interfacial thermal conductance by varying the energy parameters between them, with other parameters unchanged. The calculation results demonstrate that the thermal conductance at the metal/graphene/metal interface increases initially to a peak, and subsequently decreases and saturates at a certain value with the bonding energy of one single graphene-metal side increasing. However, for the case that bonding energies of both graphene-metal sides are increased, the metal/graphene/metal interfacial thermal conductance increases rapidly and keeps at a certain value. The simulation results present a hint to tune effectively the interfacial thermal conductance for graphene-based devices.