• 文献标题:   Fabrication of Two-Dimensional and Three-Dimensional High-Resolution Binder-Free Graphene Circuits Using a Microfluidic Approach for Sensor Applications
  • 文献类型:   Article
  • 作  者:   UZ M, LENTNER MT, JACKSON K, DONTA MS, JUNG J, HONDRED J, MACH E, CLAUSSEN J, MALLAPRAGADA SK
  • 作者关键词:   nanomanufacturing, microfluidic, flexible electronic, graphene, sensor
  • 出版物名称:   ACS APPLIED MATERIALS INTERFACES
  • ISSN:   1944-8244 EI 1944-8252
  • 通讯作者地址:   Iowa State Univ
  • 被引频次:   0
  • DOI:   10.1021/acsami.9b23460
  • 出版年:   2020

▎ 摘  要

In this study, a simple microfluidic method, which can be universally applied to different rigid or flexible substrates, was developed to fabricate high-resolution, conductive, two-dimensional and three-dimensional microstructured graphene-based electronic circuits. The method involves controlled and selective filling of microchannels on substrate surfaces with a conductive binder-free graphene nanoplatelet (GNP) solution. The ethanol-thermal reaction of GNP solution at low temperatures (similar to 75 degrees C) prior to microchannel filling (preheating) can further reduce the GNP andprovide a homogeneous GNP solution, which in turn enhances conductivity, reduces sheet resistance (similar to 0.05 k Omega sq(-1)), enables room-temperature fabrication, and eliminates harsh postprocessing, which makes this fabrication technique compatible with degradable substrates. This method can also be used in combination with 3D printing to fabricate 3D circuits. The feature sizes of the graphene patterns can range from a few micrometers (down to similar to 15 mu m in width and similar to 5 mu m in depth) to a few millimeters and use very small amounts of GNP solution (similar to 2.5 mg of graphene to obtain similar to 0.1 k Omega sq(-1) of sheet resistance for 1 cm(2)). This microfluidic approach can also be implemented using other conductive liquids, such as conductive graphene-silver solutions. This technology has the potential to pave the way for low-cost, disposable, and biodegradable circuits for a range of electronic applications including near-field communication antennas and pressure or strain sensors.