• 文献标题:   Moisture barrier properties of single-layer graphene deposited on Cu films for Cu metallization
  • 文献类型:   Article, Proceedings Paper
  • 作  者:   GOMASANG P, ABE T, KAWAHARA K, WASAI Y, NABATOVAGABAIN N, CUONG NT, AGO H, OKADA S, UENO K
  • 作者关键词:  
  • 出版物名称:   JAPANESE JOURNAL OF APPLIED PHYSICS
  • ISSN:   0021-4922 EI 1347-4065
  • 通讯作者地址:   Shibaura Inst Technol
  • 被引频次:   2
  • DOI:   10.7567/JJAP.57.04FC08
  • 出版年:   2018

▎ 摘  要

The moisture barrier properties of large-grain single-layer graphene (SLG) deposited on a Cu(111)/sapphire substrate are demonstrated by comparing with the bare Cu(111) surface under an accelerated degradation test (ADT) at 85 degrees C and 85% relative humidity (RH) for various durations. The change in surface color and the formation of Cu oxide are investigated by optical microscopy (OM) and X-ray photoelectron spectroscopy (XPS), respectively. First-principle simulation is performed to understand the mechanisms underlying the barrier properties of SLG against O diffusion. The correlation between Cu oxide thickness and SLG quality are also analyzed by spectroscopic ellipsometry (SE) measured on a non-uniform SLG film. SLG with large grains shows high performance in preventing the Cu oxidation due to moisture during ADT. (C) 2018 The Japan Society of Applied Physics.