▎ 摘　　要

Chemical vapor deposition (CVD) on Cu thin films is a promising approach for the large area formation of graphene on dielectric substrates, but a fine control of the deposition parameters is required to avoid dewetting of the Cu catalyst. In this paper we report on the study of the Cu dewetting phenomena by monitoring the intensity of the infra-red emission from the film surface during rapid thermal CVD of graphene. The reduction of Cu film coverage consequent to dewetting is detected as a variation of sample's emissivity. Results indicate three time constants of dewetting, describing three typical stages, hole formation, propagation and ligament breakup. Slowing the first incubation stage by tuning pressure in the chamber allows for an effective surface activation resulting in the deposition of graphene at temperatures lower than those in the case of Cu foils. (C) 2014 Elsevier B.V. All rights reserved.