▎ 摘　　要

Cu and graphene-coated Cu substrates spread with Sn-Zn eutectic-based alloy containing 0.5 wt.%, 1 wt.%, or 1.5 wt.% Cu have been studied at 250A degrees C. Soldering experiments were performed for wetting time of 3 min, 8 min, 15 min, 30 min, and 60 min in (1) presence of flux without argon protective atmosphere and (2) fluxless in argon atmosphere. Solidified solder-pad couples were cross-sectioned and examined using scanning electron microscopy with energy-dispersive spectroscopy to study their interfacial microstructure. To assess the effect of graphene coating on solder, Cu pads were covered by graphene using chemical vapor deposition. The results revealed that the liquid solder did not wet the graphene-coated copper in the absence of flux. Wetting took place only with use of flux, because it destroyed the graphene layer and enabled contact of the liquid solder with the copper. Experiments were designed to demonstrate the effect of Cu addition and graphene coating on the kinetics of the formation and growth of Cu5Zn8 and CuZn4 phases identified by x-ray diffraction analysis, Raman spectroscopy, and energy-dispersive spectroscopy. A decrease of about 60% in the thickness of the intermetallic layer was observed when applying the graphene interlayer in presence of flux. Addition of copper to the Sn-Zn alloy improved the wettability as the copper content was increased.