▎ 摘　　要

The continual usage of computers produces excessive heat, which directly affects the processor. The main reason for computer failure is an increase in chip temperature which degrades the performance, reliability and the lifespan of a computer. In order to avoid these limitations, excessive heat should be transferred to the environment. This research article proposes to analyze heat transfer in microprocessors through graphene layer coating. Heat transfer in pure and graphene coated microprocessors, based on 0%, 50% and 75% central processing unit (CPU) usage, has been investigated. Initially, graphene was mixed with ethanol and spin-coated on the surface of microprocessor. Scanning electron microscopy (SEM) analysis confirms the deposition of a graphene layer on the substrate. Applying graphene to the surface of the substrate significantly improves heat transfer due to high thermal conductivity. A maximum of a 5.6 degrees C difference in heat transfer has been achieved by introducing a graphene layer on the substrate. This experimental analysis proves that graphene is a suitable material for electronic applications.