• 文献标题:   A Study on Dislocation Mechanisms of Toughening in Cu-Graphene Nanolayered Composite
  • 文献类型:   Article
  • 作  者:   LEE S, GHAFFARIAN H, KIM W, LEE T, HAN SM, RYU S, OH SH
  • 作者关键词:   graphene, nanocomposite, toughening mechanism, in situ tem, md simulation
  • 出版物名称:   NANO LETTERS
  • ISSN:   1530-6984 EI 1530-6992
  • 通讯作者地址:  
  • 被引频次:   2
  • DOI:   10.1021/acs.nanolett.1c03599 EA DEC 2021
  • 出版年:   2022

▎ 摘  要

We investigated the role of graphene interfaces in strengthening and toughening of the Cu-graphene nanocomposite by a combination of in situ transmission electron microscopy (TEM) deformation and molecular dynamics (MD) simulations. In situ TEM directly showed that dislocation plasticity is strongly confined within single Cu grains by the graphene interfaces and grain boundaries. The weak Cu-graphene interfacial bonding induces stress decoupling, which results in independent plastic deformation of each Cu layer. As confirmed by the MD simulation, the localized deformation made by such constrained dislocation plasticity results in the nucleation and growth of voids at the graphene interface, which acts as a precursor for crack. The graphene interfaces also effectively block crack propagation promoted by easy delamination of Cu layers dissipating the elastic strain energy. The toughening mechanisms revealed by the present study will provide valuable insights into the optimization of the mechanical properties of metal-graphene nanolayered composites.