• 文献标题:   Rheological and Morphological Properties of Non-Covalently Functionalized Graphene-Based Structural Epoxy Resins with Intrinsic Electrical Conductivity and Thermal Stability
  • 文献类型:   Article
  • 作  者:   NOBILE MR, RAIMONDO M, NADDEO C, GUADAGNO L
  • 作者关键词:   epoxy resin, rheology, tunneling atomic force microscopy tuna, graphenebased nanocomposite, noncovalent functionalization, morphological analysi
  • 出版物名称:   NANOMATERIALS
  • ISSN:  
  • 通讯作者地址:   Univ Salerno
  • 被引频次:   1
  • DOI:   10.3390/nano10071310
  • 出版年:   2020

▎ 摘  要

In this paper, a non-covalent pi-pi interaction between graphene nanoparticles (G) and a pyrene-based molecule (py) has been successfully accomplished to give the functionalized nanofillers (G-py). The proposed modification has proven to be a winning solution aimed at safeguarding the graphene's notable electronic properties, while promoting a more effective nanofiller dispersion attributable to a decrease in viscosity with consequent improvement of the rheological properties of the formulated nanocomposites filled with G-py. The electrical current maps of the G-py based epoxy composites, loaded with filler weight percentages both above and below the electric percolation threshold (EPT), were obtained by tunneling atomic force microscopy (TUNA) technique. The possibility to detect low currents also for the sample at lower concentration (0.1 wt%) confirms the good electrical performance of the nanocomposites and, consequently, the successful performed functionalization. The non-covalent modification significantly improves the thermal stability of the unfunctionalized G of about 70 degrees C, thus causing an increase in the composite oxidative thermostability since the evolution of CO(2)shifts to higher values. Moreover, non-covalent functionalization proved to be impactful in imparting an overall enhancement of the nanocomposite mechanical properties due to good bonding between graphene and epoxy matrix, also showing a greater roughness which is decisive in influencing the interface adhesion efficiency.