• 文献标题:   Salt-templated graphene nanosheet foams filled in silicon rubber toward prominent EMI shielding effectiveness and high thermal conductivity
  • 文献类型:   Article
  • 作  者:   FAN BX, XING L, YANG KX, YANG YJ, ZHOU FJ, TONG GX, WU WH
  • 作者关键词:   3d interconnected framework, graphene foam, salttemplateguided freezedryingcalcination approach, thermal conductivity, electromagnetic shielding effectivenes, synchronous enhancement mechanism
  • 出版物名称:   CARBON
  • ISSN:   0008-6223 EI 1873-3891
  • 通讯作者地址:  
  • 被引频次:   1
  • DOI:   10.1016/j.carbon.2023.03.022 EA MAR 2023
  • 出版年:   2023

▎ 摘  要

Lightweight and multifunctional polymer-based composites with prominent electromagnetic interference (EMI) shielding effectiveness (EMI SE) and heat conductance are in urgent demand for developing highly integrated electronic devices in the 5G/6G era. Herein, ultrathin graphene nanosheet-based foams with many micropores are prepared by a general salt-template guided freeze-drying-calcination route with PEG 20000 and NaCl as a carbon source and a template, respectively. Calcination temperature (T) and PEG 20000/NaCl mass ratio (lambda) were employed to modulate the texture, defects, graphitization, EM parameters, EMI SE, and thermal conductivity of graphene foams. The graphene foams formed under T = 800 degrees C and lambda = 0.530 exhibited the optimal EMI SE and thermal conductivity. The EMI SE is beyond 20 dB over C, S, and Ku wavebands with a low filling ratio of 7 wt%, exceeding most graphene-based materials. Meanwhile, three-dimensional (3D) interconnected frameworks reduce inter-nanosheet contact thermal resistance and provide continuous frameworks for thermal and electrical conduction, engendering a larger heat conductivity (3.26-3.95 W m(-1) K-1) under a lower filling ratio (3-5 wt%) compared to most reported composites. Together with their high SBET (255.6-670.5 m(2) g(-1)) and light weight, the graphene foams synthesized in this research are expected to be utilized as a thermally conductive and EMI shielding filler for advanced electronic packaging.