• 文献标题:   Evaluating a Human Ear-Inspired Sound Pressure Amplification Structure with Fabry-Perot Acoustic Sensor Using Graphene Diaphragm
  • 文献类型:   Article
  • 作  者:   LI C, XIAO X, LIU Y, SONG XF
  • 作者关键词:   sound pressure amplification structure, double diaphragm scheme, fabryperot sensor, graphene diaphragm, sensitivity enhancement
  • 出版物名称:   NANOMATERIALS
  • ISSN:  
  • 通讯作者地址:  
  • 被引频次:   4
  • DOI:   10.3390/nano11092284
  • 出版年:   2021

▎ 摘  要

In order to enhance the sensitivity of a Fabry-Perot (F-P) acoustic sensor without the need of fabricating complicated structures of the acoustic-sensitive diaphragm, a mini-type external sound pressure amplification structure (SPAS) with double 10 mu m thickness E-shaped diaphragms of different sizes interconnected with a 5 mm length tapered circular rod was developed based on the acoustic sensitive mechanism of the ossicular chain in the human middle ear. The influence of thickness and Young's modulus of the two diaphragms with the diameters of 15 mm and 3 mm, respectively, on the amplification ratio and frequency response were investigated via COMSOL acoustic field simulation, thereby confirming the dominated effect. Then, three kinds of dual-diaphragm schemes relating to steel and thermoplastic polyurethanes (TPU) materials were introduced to fabricate the corresponding SPASs. The acoustic test showed that the first scheme achieved a high resonant response frequency with lower acoustic amplification due to strong equivalent stiffness; in contrast, the second scheme offered a high acoustic amplification but reduced frequency range. As a result of sensitivity enhancement, adapted with the steel/TPU diaphragm structure, an optical fiber Fabry-Perot sensor using a multilayer graphene diaphragm with a diameter of 125 mu m demonstrated a remarkable sensitivity of 565.3 mV/Pa @1.2 kHz due to the amplification ratio of up to similar to 29.9 in the range of 0.2-2.3 kHz, which can be further improved by miniaturizing structure dimension, along with the use of microstructure packaging technology.