▎ 摘 要
Compression studies on three-dimensional foam-like graphene and h-BN (3D-C and 3D-BN) revealed their high cross plane thermal conductivity (62-86 W m(-1) K-1) and excellent surface conformity, characteristics essential for thermal management needs. Comparative studies to state-of-the-art materials and other materials currently under research for heat dissipation revealed 3D-foam's improved performance (20-30% improved cooling, temperature decrease by triangle T of 44-24 degrees C).