▎ 摘　　要

The high heat dissipation of high-power electronic equipment has become a major cause of damage, especially the central processing units (CPUs) of computers and other electronic devices. Accordingly, this research aims to improve the thermal conductivity as well as the mechanical properties of aluminum (Al) by mono and hybrid reinforcements of silver (Ag) and graphene (G) so that they can be used for heat dissipation. The structures of the prepared powders were investigated using the X-ray diffraction (XRD) technique. Furthermore, the sintered composites' microstructure, density, thermal conductivity, mechanical properties, and electrical conductivity were investigated. The results showed that adding Ag percentages led to forming the Ag2Al phase while adding graphene decreased the crystallite of the milled powder. The SEM results showed that the samples had high densification, which was slightly reduced with increasing percentages of reinforcements. Importantly, Al's thermal conductivity and mechanical properties were significantly improved due to the addition of Ag and G reinforcements with a slight decrease in electrical conductivity. The highest thermal conductivity was observed a 278.86 W/mK in the sample containing 5 vol.% of Ag and 2.5 vol.% of G, which was improved by about 20.6%. In contrast, the highest microhardness and Young's modulus were 39.19 HV and 71.67 GPa, which resulted in an improvement of about 30.7 and 17.8% for the sample containing 2.5 vol.% of Ag and 5 vol.% of G when compared to the Al matrix. Based on these promising findings, it is possible to infer that the objective of this study was effectively attained and that the created composites are appropriate for such applications.