• 文献标题:   Scalable growth of free-standing graphene wafers with copper(Cu) catalyst on SiO2/Si substrate: Thermal conductivity of the wafers
  • 文献类型:   Article
  • 作  者:   LEE YH, LEE JH
  • 作者关键词:   catalyst, chemical vapour deposition, copper, cvd coating, graphene, metallic thin film, nondestructive testing, raman spectra, silicon, silicon compound, thermal conductivity
  • 出版物名称:   APPLIED PHYSICS LETTERS
  • ISSN:   0003-6951
  • 通讯作者地址:   Korea Univ
  • 被引频次:   47
  • DOI:   10.1063/1.3324698
  • 出版年:   2010

▎ 摘  要

The authors report scalable growth of free-standing graphene wafers with copper(Cu) catalyst on SiO2/Si substrate at low temperature and investigation of their thermal conductivity. The Cu is the most common and the cheapest catalyst among electronic materials. Our process for producing the graphene with the Cu is based on a low-pressure, fast-heating chemical vapor deposition method. Thermal conductivity measurements with nondestructive Raman spectroscopy showed that the free-standing-graphene is a good thermal conductor. The possibility of growing graphene wafer at low temperatures by using a Cu thin film should accelerate research and facilitate the development of graphene for practical applications.