• 文献标题:   Tailored pyroresistive performance and flexibility by introducing a secondary thermoplastic elastomeric phase into graphene nanoplatelet (GNP) filled polymer composites for self-regulating heating devices
  • 文献类型:   Article
  • 作  者:   LIU Y, ZHANG H, PORWAL H, TU W, WAN KN, EVANS J, NEWTON M, BUSFIELD JJC, PEIJS T, BILOTTI E
  • 作者关键词:  
  • 出版物名称:   JOURNAL OF MATERIALS CHEMISTRY C
  • ISSN:   2050-7526 EI 2050-7534
  • 通讯作者地址:   Queen Mary Univ London
  • 被引频次:   4
  • DOI:   10.1039/c7tc05621d
  • 出版年:   2018

▎ 摘  要

Flexible and controllable self-regulating heating devices have great potential for use in applications such as healthcare devices, soft robotics, artificial skins and wearable electronics. Conventional self-regulating heating devices are often limited by the rigid nature of the polymer matrices, particularly at high conductive filler concentrations. In this paper, this limitation has been successfully tackled by using binary polymer blends that can achieve a desirable combination of mechanical, electrical and pyroresistive properties. The addition of a suitable secondary thermoplastic elastomeric polymeric phase did not only improve material flexibility, but did also tune the positive temperature coefficient (PTC) behaviour. For the first time, we systematically explore the effect of different blend morphologies as well as the selective localization of conductive fillers like graphene nanoplatelets (GNPs) on the overall mechanical and pyroresistive performance of self-regulating conductive polymer composites (CPCs). The effect of different blend morphologies was studied using different thermoplastic elastomers (TPEs) as secondary phases, and various blend compositions, into a GNP filled high density polyethylene (HDPE) nanocomposite. Blend morphologies included immiscible binary blends with a fine and coarse droplet morphology and a co-continuous morphology. In doing so, this study serves as a guideline for the selection of a secondary elastomeric phase in polymer blend based CPCs for optimised device flexibility and self-regulating heating functions.