• 文献标题:   Dual thermodynamics approach to the temperature dependence of viscoplastic creep durability in graphene-based nanocomposites
  • 文献类型:   Article
  • 作  者:   XIA XD, DU ZJ, SU Y, LI JC, WENG GJ
  • 作者关键词:   graphenebased viscoplastic nanocomposite, temperature dependent secant modulu, dual thermodynamics processe, time temperature superposition, creep durability
  • 出版物名称:   INTERNATIONAL JOURNAL OF PLASTICITY
  • ISSN:   0749-6419 EI 1879-2154
  • 通讯作者地址:  
  • 被引频次:   0
  • DOI:   10.1016/j.ijplas.2022.103400 EA AUG 2022
  • 出版年:   2022

▎ 摘  要

The ambient temperature at which creep deformation takes place is known to exert significant influence on the creep durability of graphene-based nanocomposites, but at present no theory could illustrate the underlying microstructural evolution to predict such a phenomenon. In this paper, a novel dual thermodynamics approach in conjunction with a time-temperature super-position principle (TTSP) is established to address this issue. First, temperature-dependent secant moduli are exclusively adopted as the unique homogenization variables shifted through TTSP, and then the time-and temperature-dependent effective stresses inside the matrix are calculated via the principle of equivalent work rate combined with the field-fluctuation method. Next, the dual irreversible thermodynamic processes, including the stress-induced creep damage inside the matrix and the temperature-dependent degradation at the interphase, are introduced through two independent sets of evolution equations. The predicted creep rupture strain and rupture time are calibrated with experiments over a wide range of temperature. It is demonstrated that the creep rupture strain increases with the rise of ambient temperature, while the creep rupture time de-creases with it. The onset of creep-damage process also commences earlier at higher temperature. This research can provide a design guidance to assess the damage process and failure of low -dimensional nanocomposites at elevated temperature environment.