• 文献标题:   Fabrication and Thermal properties of graphene nanoplatelet-enhanced phase change materials based on paraffin encapsulated by melamine-formaldehyde
  • 文献类型:   Article
  • 作  者:   KHEZRI A, SAHEBI M, MOHAMMADI M
  • 作者关键词:   phase change nanocomposite, energy storage, microencapsulation, graphene
  • 出版物名称:   JOURNAL OF THERMAL ANALYSIS CALORIMETRY
  • ISSN:   1388-6150 EI 1588-2926
  • 通讯作者地址:  
  • 被引频次:   7
  • DOI:   10.1007/s10973-021-11085-7 EA OCT 2021
  • 出版年:   2022

▎ 摘  要

In this study, a series of phase change nanocomposites using microencapsulated phase change material and graphene nanoplatelet (as an additive material) is synthesized to enhance PCM thermal properties. Paraffin as a PCM is encapsulated by melamine-formaldehyde as a shell material via in situ polymerization method. Graphene nanoplatelet as a heat transfer promoter is added among the microencapsulated phase change materials (MPCMs) in different mass fractions to form phase change nanocomposites. By the applied technique, the defect of leakage and the low thermal conductivity of the phase change material can be overcome simultaneously. The experimental measurements show that the thermal conductivity of the PCNs effectively enhances without a significant influence on their phase change enthalpy. The results indicate that when the amount of the graphene nanoplatelets increases, the thermal diffusivity and thermal conductivity enhance. By using 10 mass % graphene nanoplatelets in the PCN, the PCN's thermal diffusivity and thermal conductivity are raised by 93% and 48%, respectively. The DSC results show that the maximum latent heat of the PCNs is 95.97 J g(-1) (PCN with 1 mass % of graphene). However, the maximum difference in the latent heat of PCNs with different graphene percentages is less than 4%. Thermal stability experiments show that the PCNs have a stable structure up to 165 degrees C without damaging the microcapsule shell. The fabricated PCNs, compared to many previous works, have good thermal properties and low cost which can properly be considered in thermal energy storage and thermal management applications.