• 文献标题:   Rational Formulation of Graphene Nanocomposite Ink for 2D Mutually Embedded Structure Interdigital Microsupercapacitors
  • 文献类型:   Article
  • 作  者:   CHEN HQ, MAO Z, CHEN SB, ZHANG YJ, HU XJ, XIN SX, BAI YX
  • 作者关键词:   graphene/mno2 nanocomposite ink, high printing efficiency, mutually embedded structure, scalable fabrication, microsupercapacitor
  • 出版物名称:   ACS APPLIED ENERGY MATERIALS
  • ISSN:   2574-0962
  • 通讯作者地址:  
  • 被引频次:   1
  • DOI:   10.1021/acsaem.1c01911 EA SEP 2021
  • 出版年:   2021

▎ 摘  要

Recently, a substantial advancement in flexible printed electronics such as a microsupercapacitor (MSC) has motivated researchers to exploit the printable multifunctional graphene inks. Of particular interest are conductive-additive-manufacturing, eco-benign, high-viscosity inks devoid of multistep sophisticated postprocessing. Because of the high nanofiller loading required, fabricating such highly concentrated inks with an efficient combination of active nanofillers and appropriate rheological properties still remains a significant challenge. In this context, we demonstrate highly concentrated nanocomposite aqueous inks consisting essentially of mutually embedded two-dimensional (2D) nanosheets (graphene/MnO2) for the scalable screen printing of interdigital MSCs. Remarkably, the engineered Gr/MnO2-interpenetrated 2D nanostructure endows the flexible MSCs with an outstanding electrical conductivity (53.3 S/cm) and prominent energy storage performance. The as-printed patterns are presented on diversiform substrates with fine spatial uniformity, showcasing excellent flexibility and scalability. Importantly, the optimized Gr/MnO2-MSCs with a printed electrode thickness of 18.4 mu m deliver a maximum single-cell areal capacitance of 16.1 mF cm(-2) and a high energy density of 3.22 mu W h cm(-2) at a power density of 0.018 mW cm(-2). The feasible protocol of formulating printable nanocomposite ink highlights the great potential of engineering multipurpose inks involving flake-like nanofillers for high-throughput and sustainable production of low-cost flexible and portable electronics.