▎ 摘　　要

The formation and growth of intermetallic compound (IMC) layer at the interface between Sn0.7Ag0.5Cu (SAC0705) solder and Cu or graphene-coated Cu (G-Cu) substrates were investigated during soldering and aging. The samples were soldered on a heating platform by aging treatment at 120 degrees C for up to 600 h. The results show that the thickness of IMC increases with increasing the aging time. The Cu6Sn5 IMC layer is observed at SAC0705/Cu and SAC0705/G-Cu interfaces. With the addition of Ni element in the solder, Cu6Sn5 transforms into (Cu, Ni)(6)Sn-5. With the increase of Ni content, the thickness of IMC shows an increase trend first and then decreases on the two kinds of substrates. Moreover, as the Ni content increases, the growth rate constant of interfacial IMC layer decreases. Since the graphene layer works as a diffusion barrier, the IMC on G-Cu is thinner than that on Cu substrate. And the growth rate constant of the interfacial IMC on G-Cu substrate is lower than that on Cu substrate.