▎ 摘　　要

MgLiAl base composites strengthened with graphene platelets were prepared by semisolid processing of ball-milled alloy chips with 2% of graphene platelets. Composites strengthened with graphene platelets show higher hardness and yield stress than the cast alloys, i.e., 160 MPa as compared to 90 MPa for as-cast alloy MgLi9Al1.5. Mechanical properties for MgLiAl-based composites were similar or higher than for composites based on conventional AZ91 or WE43 alloys. The strengthening however was not only due to the presence of graphene, but also phases resulting from the reaction between carbon and lithium, i.e., Li2C2 carbide. Graphene platelets were located at globules boundaries resulting from semisolid processing for all investigated composites. Graphene platelets were in agglomerates forming continuous layers at grain boundaries in the composite based on the alloy MgLi4.5Al1.5. The shape of agglomerates was more complex and wavy in the composite based on MgLi9Al1.5 alloy most probably due to lithium-graphene reaction. Electron diffraction from the two-phase region alpha + beta in MgLi9Al1.5 indicated that [001]alpha and [110]beta directions are rotated about 4A degrees from the ideal relationship [001] hex || [110] bcc phases. It showed higher lattice rotation than in earlier studies what is most probably caused by lattice slip and rotation during semisolid pressing causing substantial deformation particularly within the beta phase. Raman spectroscopy studies confirmed the presence of graphene platelets within agglomerates and in addition the presence mainly of Li2C2 carbides in composites based on MgLi4.5Al1.5 and Mg9Li1.5Al alloys. From the character of Raman spectra refinement of graphene platelets was found in comparison with their initial size. The graphene areas without carbides contain graphene nanoplatelets with lateral dimension close to initial graphene sample. Electron diffraction allowed to confirm the presence of Li2C2 carbide at the surface of agglomerates found from Raman spectroscopy results.