• 文献标题:   Enhanced thermal conductivity and dimensional stability of flexible polyimide nanocomposite film by addition of functionalized graphene oxide
  • 文献类型:   Article
  • 作  者:   TSENG IH, CHANG JC, HUANG SL, TSAI MH
  • 作者关键词:   graphene oxide, polyimide, thermal conductivity, coefficient of thermal expansion cte, surface resistance
  • 出版物名称:   POLYMER INTERNATIONAL
  • ISSN:   0959-8103 EI 1097-0126
  • 通讯作者地址:   Natl Chin Yi Univ Technol
  • 被引频次:   56
  • DOI:   10.1002/pi.4375
  • 出版年:   2013

▎ 摘  要

Polyimide (PI) nanocomposites with both enhanced thermal conductivity and dimensional stability were achieved by incorporating glycidyl methacrylate-grafted graphene oxide (g-GO) in the PI matrix. The PI/g-GO nanocomposites exhibited linear enhancement in thermal conductivity when the amount of incorporated g-GO was less than 10 wt%. With the addition of 10 wt% of g-GO to PI (PI/g-GO-10), the thermal conductivity increased to 0.81 W m1 K1 compared to 0.13 W m1 K1 for pure PI. Moreover, the PI/g-GO-10 composite exhibited a low coefficient of thermal expansion (CTE) of 29 ppm degrees C1. The values of CTE and thermal conductivity continuously decreased and increased, respectively, as the g-GO content increased to 20 wt%. Combined with excellent thermal stability and high mechanical strength, the highly thermally conducting PI/g-GO-10 nanocomposite is a potential substrate material for modern flexible printed circuits requiring efficient heat transfer capability.