• 文献标题:   Electroless Ni-plated graphene for tensile strength enhancement of copper
  • 文献类型:   Article
  • 作  者:   JIANG RR, ZHOU XF, LIU ZP
  • 作者关键词:   graphene, copper, electroless plating, strength, electrical conductivity
  • 出版物名称:   MATERIALS SCIENCE ENGINEERING ASTRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE PROCESSING
  • ISSN:   0921-5093 EI 1873-4936
  • 通讯作者地址:   Chinese Acad Sci
  • 被引频次:   22
  • DOI:   10.1016/j.msea.2016.10.029
  • 出版年:   2017

▎ 摘  要

Graphene nanosheets have shown a significant strengthening effect for metal matrixes. In this paper, we develop a novel eletroless plating method to prepare Ni decorated graphene as an enhancing component in a copper matrix. A good dispersion of Ni nanoparticles on graphene sheets is achieved, which effectively enhances the interfacial compatibility between graphene and copper. The electroless plated graphene-copper composite bulk has a better performance in the mechanical tensile strength compared to pure copper, and also maintains superior ductility, elongation and electrical conductivity.