▎ 摘　　要

To address the issues of electromagnetic interference (EMI) shielding and thermal management during operation of electronic devices, carbon foam/reduced graphene oxide/paraffin dual-functional composite phase change material (c-MG/PA) is fabricated via reductive assembly and vacuum impregnation. The carbonized melamine foam and graphene jointly construct a three-dimensional electrical conductive and thermal conductive synergistic network. EMI shielding efficiency of c-MG/PA at thickness of 2 mm is up to 49 dB dominated by the electromagnetic absorption mechanism of the double conductive carbon network, far outstripping the commercial application standard of 20 dB. The phase change enthalpy of c-MG/PA reaches at least 196.3 J center dot g(-1), and the relative enthalpy efficiency is above 97.4 %. Because of the enhancement of three-dimensional heat transfer network, the thermal conductivity of c-MG/PA is 324 % higher than that of paraffin. By using c-MG/PA as thermal management material in analog electronic chip, the chip temperature remarkably drops by 17.1 degrees C. In addition, c-MG/PA also exhibits superior shape stability, cycling stability and thermal stability, ensuring the reliability and security for long-term use in electronic devices. The results reveal that c-MG/PA possesses great application potential in EMI shielding and thermal management.