• 文献标题:   Breaking the Rate-Integrity Dilemma in Large-Area Bubbling Transfer of Graphene by Strain Engineering
  • 文献类型:   Article
  • 作  者:   MA LP, DONG SC, CHENG HM, REN WC
  • 作者关键词:   adhesive, compressive strain, delamination rate, graphene, structural integrity
  • 出版物名称:   ADVANCED FUNCTIONAL MATERIALS
  • ISSN:   1616-301X EI 1616-3028
  • 通讯作者地址:  
  • 被引频次:   4
  • DOI:   10.1002/adfm.202104228 EA JUN 2021
  • 出版年:   2021

▎ 摘  要

Efficient electrochemical bubbling delamination is highly promising for realizing the scalable transfer of high-quality chemical vapor deposition (CVD) graphene film. However, it remains a challenge to significantly improve the low delamination rate of large-area graphene without causing structural damage. Here, a strain-engineering strategy is reported to break this rate-integrity dilemma by introducing appreciable compressive strain into graphene to dramatically accelerate the delamination of CVD graphene from Cu foil in a non-destructive manner. An astonishing 25-fold improvement in the delamination rate is achieved by hot bubbling graphene coated with a post-cured UV-epoxy adhesive. Meanwhile, the inherent structural integrity of delaminated graphene films is well preserved. The strategy is superior to the prevalent methods by simultaneously realizing the unprecedented high-rate delamination and intact transfer. It is further demonstrated that it allows the highly efficient roll-to-roll bubbling transfer of meter-scale high-quality graphene films.