• 文献标题:   Synergistic enhancement of thermal conductivity by addition of graphene nanoplatelets to three-dimensional boron nitride scaffolds for polyamide 6 composites
  • 文献类型:   Article
  • 作  者:   WU FJ, CHEN AL, PAN HL, LI DH, ZHANG LJ, FANG H, PENG XF, BEKYAROVA E
  • 作者关键词:   boron nitride, polyamide, synergistic enhancement, thermal conductivity, three #8208, dimensional scaffold
  • 出版物名称:   POLYMER ENGINEERING SCIENCE
  • ISSN:   0032-3888 EI 1548-2634
  • 通讯作者地址:  
  • 被引频次:   8
  • DOI:   10.1002/pen.25658 EA FEB 2021
  • 出版年:   2021

▎ 摘  要

Three-dimensional boron nitride/graphene nanoplatelets (3D-BN-GNP) scaffolds were fabricated using an ice-templating method and polyamide 6 (PA6)-based composites were prepared by vacuum impregnation of caprolactam monomers into the scaffolds, followed by polymerization. The BN sheets in the PA6/3D-BN and PA6/3D-BN-GNP composites display a predominant parallel alignment along the ice-crystal formation constructing thermally conductive paths. The addition of few GNPs assists the dispersion of BN sheets in the PA6/3D-BN-GNP composites and repair the broken thermal paths caused by local agglomeration of the BN sheets. Consequently, GNPs play a morphology-promoted synergistic role in the enhancement of the thermal conductivity of the PA6/3D-BN-GNP composites. The PA6/3D-BN-GNP composite prepared with 23.40 wt% BN sheets and 2.60 wt% GNPs exhibits the highest thermal conductivity of 2.80 W m(-1) K-1, which is 833% and 33% higher than the values recorded for the pure PA6 and the PA6/3D-BN composite at BN loading of 26.18 wt%, respectively. Infrared imaging analysis revealed that the surface of the PA6/3D-BN-GNP composite has a fast response to heating and cooling, suggesting the potential of the composites in thermal management applications.