• 文献标题:   Graphene/biphenylene heterostructure: Interfacial thermal conduction and thermal rectification
  • 文献类型:   Article
  • 作  者:   REN K, CHEN Y, QIN HS, FENG WL, ZHANG G
  • 作者关键词:  
  • 出版物名称:   APPLIED PHYSICS LETTERS
  • ISSN:   0003-6951 EI 1077-3118
  • 通讯作者地址:  
  • 被引频次:   10
  • DOI:   10.1063/5.0100391
  • 出版年:   2022

▎ 摘  要

The allotrope of carbon, biphenylene, was prepared experimentally recently [Fan et al., Science 372, 852-856 (2021)]. In this Letter, we perform first-principles simulation to understand the bonding nature and structure stability of the possible in-plane heterostructure built by graphene and biphenylene. We found that the graphene-biphenylene in-plane heterostructure only exhibits along the armchair direction, which is connected together by strong covalent bonds and energetically stable. Then, the non-equilibrium molecular dynamics calculations are used to explore the interfacial thermal properties of the graphene/biphenylene heterostructure. It is found that the graphene/biphenylene in-plane heterostructure possesses an excellent interfacial thermal conductance of 2.84 x 10(9) W & BULL;K-1 & BULL;m(-2) at room temperature. Importantly, the interfacial thermal conductance presents different temperature dependence under opposite heat flux direction. This anomalous temperature dependence results in increased thermal rectification ratio with temperature about 40% at 350 K. This work provides comprehensive insight into the graphene-biphenylene heterostructure and suggests a route for designing a thermal rectifier with high efficiency. Published under an exclusive license by AIP Publishing.