▎ 摘　　要

With the remarkable increment speed of consumer electronics, shielding materials qualified for favourable minimal thickness, mechanical behaviors and efficient conduction path are imperiously demanded. To manufacture desired shielding materials qualified for favourable mechanical behaviors and efficient conduction path, we designed a foam-like nonwoven multiscale composite with welding-network, sandwich and random orientation combined architectures for the first time. A 0.5-mm-thick epoxy composite exhibits an outstanding shielding effectiveness of 65 dB, and the specific electromagnetic interference shielding effectiveness reaches to similar to 23103.4 dB cm(2) g(-1), which surpassed that in reported literature. The continuous backbone with sandwich microstructure enables the epoxy composites to be mechanically robust with the tensile MPa of 349. The exceptional mechanical performance exhibited an alternative approach to exploit potentials of carbon fiber-based nonwoven fabrics for developing advanced multifunctional materials.