▎ 摘　　要

Transient electronics are an emerging technology for civilian and government applications that require controlled disintegration of an electronic chip into smaller components, by physical or chemical means. Here, a pillar-on-polymer architecture is presented for a transient system where the electronic components are partitioned on an array of silicon pillars. The pillars are mechanically tethered by a vaporizable polymer film and electrically routed with atomically thin graphene interconnects. Polymer vaporization is achieved with Joule heating of thin-film metal heaters associated with each silicon pillar, which singulates the pillar. The pillar singulation breaks the graphene interconnects locally, without collateral damage to other on-chip components. This process demonstrates a methodology for temporally and spatially controlled transience as any single pillar can be singulated at any time. A novel polymer-silicon layer transfer fabrication process is used to microfabricate a 3 x 3 array of 200 mu m diameter silicon pillars spaced 200 mu m apart, with gold heaters and graphene interconnects, and the controlled singulation of individual pillars is demonstrated. As a demonstration of a sensor in this technology, a piezoresistive accelerometer is integrated with this platform, which uses a silicon pillar array suspended from the polymer film as a proof mass.