• 文献标题:   Three-Dimensional Stacked Multilayer Graphene Interconnects
  • 文献类型:   Article
  • 作  者:   YU TH, LIANG CW, KIM C, SONG ES, YU B
  • 作者关键词:   contact resistivity, interconnect, sheet resistance, stacked multilayer graphene smlg
  • 出版物名称:   IEEE ELECTRON DEVICE LETTERS
  • ISSN:   0741-3106
  • 通讯作者地址:   Novellus Syst Inc
  • 被引频次:   25
  • DOI:   10.1109/LED.2011.2158385
  • 出版年:   2011

▎ 摘  要

We experimentally demonstrate stacked multilayer graphene (MLG) (s-MLG) as a new material system for high-performance carbon interconnects. Electrical performance is systematically characterized. We discover that the wire sheet resistance of s-MLG decreases with more layers stacking and shows better conductivity than that of the exfoliated MLG sample with the same layer numbers. The contact resistance of the s-MLG samples was calculated and confirmed using two different methods. It is demonstrated that a decrease in the intrinsic resistivity of s-MLG with increasing layer number is discovered; however, contact resistance will be saturated with more stacked layer numbers.