▎ 摘　　要

Graphene (Gr)/Copper (Cu) composites have shown great potential in thermal-management and information-transport applications. The influences of interface related characteristics, such as orienta-tion, adhesion energy and localized strain are of great importance, however, rarely reported. In this work, by conducting heavy ions irradiation and thermal boundary conductance characterization (by time-domain thermoreflectance technique), we examined the intrinsic relationship between microstructural characteristics and interface stability of various Gr/Cu interfaces, such as Gr/{10 0} Cu, Gr/{111} Cu, and Gr/{111}/{100} Cu. Here we report: (1) compared to Gr/{111} Cu interfaces, Gr/{10 0} Cu interfaces exhibit higher defect sink capability, and (2) Gr/{111}/{100} Cu interfaces possess both high defect sink capabil-ity and good interface stability. Our atomistic simulations suggest higher interface volumetric stress of Gr/{10 0} Cu interface. The synergistic enhancement of Gr/{111} Cu and {111}/{100} Cu interfaces is at-tributed to coherent interface generated by Gr assisted Cu surface reconstruction. The present findings may provide more insight to understand the interface characteristics-stability relation of carbon/metal composites. (c) 2022 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.