▎ 摘　　要

In this paper, we report our works on the fabrication of reduced graphene oxide (RGO) and graphene oxide (GO) embedded polyimide (PI) nanohybrid films and their dielectric and thermal properties. The RGO-PI films exhibit higher dielectric permittivity than the GO-PI films and the RGO-PI films show a lower percolation threshold of 0.0172 in volume fraction. The TGA and DMA analysis indicate that all the films have excellent thermal stability and thermo-mechanical properties, and the RGO-PI films exhibit a higher thermal decomposition temperature than GO-PI and pure PI films.