▎ 摘 要
In this work, we evaluate the material properties of graphene and assess the potential application of graphene to replace copper wires in Back-End-Of-Line (BEOL) interconnects. Based on circuit and system-level simulations, high restrictions are imposed to graphene with respect to contact resistance and mean free path. Experimentally we evaluate single and multi-layer graphene wires and we measure carrier mean free paths (MFPs) above similar to 110 nm. However, contact engineering will be the key issue for integration of graphene as interconnect. (C) 2016 Elsevier B.V. All rights reserved.