▎ 摘　　要

Metal substitution is always the focus of scientific research in printed circuit board (PCB) and 5G communication technology. It is proved that the high thermal conductive carbon-based materials can be potential alternatives. However, the relatively low electrical conductivity and the difficulties in integrating carbon-based materials to functional substrates limit their further and industrial applications. Herein, a method is developed to fabricate large-scale, binder-free, flexible graphene clad laminate (GCL) by hot pressing assistant under vacuum to achieve excellent electrical properties and well-connected interface for PCB application, thus accomplishing metal substitution. GCL is a sandwich structure construct of top and bottom layers of high-conductivity graphene assembled film as a conductive layer and a dielectric substrate layer. A 5G millimeter wave antenna array based on GCL PCB operated at 26 GHz is designed, fabricated, and characterized. The GCL antenna array has a reflection coefficient of -20.98 dB and a realized gain of 11.05 dBi, which are comparable to the metal antenna array made of the commercial copper clad laminate-based PCB. All the measurement results show that the flexible and lightweight GCL can be used as a new generation PCB for flexible electronic devices and radio frequency devices.