• 文献标题:   Thermal Properties of Graphene-Copper-Graphene Heterogeneous Films
  • 文献类型:   Article
  • 作  者:   GOLI P, NING H, LI XS, LU CY, NOVOSELOV KS, BALANDIN AA
  • 作者关键词:   graphene, copper, thermal propertie, graphene coating, graphenecopper interconnect, thermal conductivity
  • 出版物名称:   NANO LETTERS
  • ISSN:   1530-6984 EI 1530-6992
  • 通讯作者地址:   Univ Manchester
  • 被引频次:   123
  • DOI:   10.1021/nl404719n
  • 出版年:   2014

▎ 摘  要

We demonstrated experimentally that graphene-Cu-graphene heterogeneous films reveal strongly enhanced thermal conductivity as compared to the reference Cu and annealed Cu films. Chemical vapor deposition of a single atomic plane of graphene on both sides of 9 mu m thick Cu films increases their thermal conductivity by up to 24% near room temperature. Interestingly, the observed improvement of thermal properties of graphene Cu graphene heterofilms results primarily from the changes in Cu morphology during graphene deposition rather than from graphene's action as an additional heat conducting channel. Enhancement of thermal properties of graphene-capped Cu films is important for thermal management of advanced electronic chips and proposed applications of graphene in the hybrid graphene-Cu interconnect hierarchies.