• 文献标题:   Horizontally aligned graphene/silver heterostructure for anisotropically highly thermoconductive polymer-based composites by stress-induced assembly
  • 文献类型:   Article
  • 作  者:   GUO H, HU BY, WANG Q, LIU J, LI M, LI B
  • 作者关键词:   polymer composite, horizontally oriented graphene, stressinduced assembly, heterostructure, thermal conductivity
  • 出版物名称:   APPLIED SURFACE SCIENCE
  • ISSN:   0169-4332 EI 1873-5584
  • 通讯作者地址:  
  • 被引频次:   1
  • DOI:   10.1016/j.apsusc.2023.156404 EA JAN 2023
  • 出版年:   2023

▎ 摘  要

Urged by the increasing power density of electronics, efficient heat dissipation by graphene-embedded polymer composites with high thermal conductivity (.) has become a growing demand for addressing overheating issues. However, it is still challenging to achieve a. over 20 W m(-1) K-1 below 20 wt% loading. Herein, we report a highly thermally conductive polymer composite based on self-assembled construction of horizontally aligned graphene/silver (f-GE/Ag) heterostructure, which is fabricated by in-situ deposition of ultra-small Ag nanoparticles on functionalized graphene followed by stress-induced orientation process, consequently achieving efficient heat-transfer pathways with low interfacial thermal barriers. The resultant f-GE/Ag contributes to the composite with a high. of 25.22 W m(-1) K-1 at 15 wt% loading, giving an ultra-high. enhancement over 12500 %. Additionally, the thermal management application of composites as thermal interface materials integrated with power LEDs is demonstrated. The finding raises the possibility for practical application of high-performance polymer composites in the thermal management of electronics.