• 文献标题:   Dielectric and mechanical properties and thermal stability of polyimide-graphene oxide composite films
  • 文献类型:   Article, Proceedings Paper
  • 作  者:   CHEN MH, YIN JH, JIN R, YAO L, SUA B, LEI QQ
  • 作者关键词:   polymermatrix, microstructure, dielectric propertie, strength, thermal stability
  • 出版物名称:   THIN SOLID FILMS
  • ISSN:   0040-6090
  • 通讯作者地址:   Harbin Univ Sci Technol
  • 被引频次:   39
  • DOI:   10.1016/j.tsf.2015.01.005
  • 出版年:   2015

▎ 摘  要

Graphene oxide (GO) was incorporated into polyimide (PI) resin to obtain composite films via in-situ polymerization method. The GO sheets were well dispersed in the PI matrix due to the hydrophilic nature of oxygen-containing groups in GO sheets. The resulting composite's mechanical, electrical and thermal properties are effectively enhanced by the incorporation of GO even at a low content. The effects of GO content on the dielectric permittivity, loss tangent and breakdown strength were simultaneously studied. The tensile strength of the PI composites was significantly increased by 40% for a 0.5 wt.% GO addition and the tensile elongation (32%) was three times greater than that of pure PI film. In addition, enhanced thermal stability was also achieved. Our composite design and fabrication methodology can be extended to many other polymer composites and thus provide a simple approach to reinforce the properties for polymer matrix in other applications. (C) 2015 Elsevier B.V. All rights reserved.