• 文献标题:   Highly conductive EGaIn/silk fibroin ink for graphene 3D array structure micro-supercapacitors
  • 文献类型:   Article
  • 作  者:   ZHANG YR, CHENG ZL, NI CK, WANG ZX, YU YS, ZHAI XX, XU SL, ZHAO ZW, HU L, HU Y
  • 作者关键词:   egain/silk fibroin ink, conductivity recovery mechanism, scalable fabrication, 3d array structure, microsupercapacitor
  • 出版物名称:   CHEMICAL ENGINEERING JOURNAL
  • ISSN:   1385-8947 EI 1873-3212
  • 通讯作者地址:  
  • 被引频次:   5
  • DOI:   10.1016/j.cej.2021.132084 EA SEP 2021
  • 出版年:   2022

▎ 摘  要

Ink-based screen-printed processes are a practical approach for scalable fabrication of wearable electronics with cost effectiveness and high throughput. However, a few challenges persist with respect to the electronic con-ductivity and ions diffusion rate of such devices. In this study, we investigated an EGaIn/Silk fibroin (SF) ink and a screen-printed strategy to fabricate graphene 3D array structure Micro-supercapacitors (MSCs) based on high conductivity EGaIn collector. The EGaIn/SF ink, owing to the coordination and chelation between SF and EGaIn, shows excellent stability and can be used to fabricate conductive patterns on flexible substrates. Interestingly, these EGaIn patterns exhibit a novel conductivity recovery mechanism, including gravity deposition, evaporation induction, mechanical sintering, and EGaIn surface self-healing. Simultaneously, by adjusting screen meshes and accurately printing graphene ink, we obtained a graphene 3D array structure interdigital electrode on the EGaIn layer, which shows a large specific surface area and obviously multidirectional ion diffusion effect. As proofs, the resultant MSCs-100 delivered an outstanding areal (volume) capacitance of 35.72 mF cm(-2) (10.26F cm(-3)) at a current density of 25 mu A cm(-2), remarkable flexibility and cycling stability. Moreover, we have realized the cycling stability characterization of integrated equipment, which holds great potential for application in future flexible and wearable electronics.