▎ 摘　　要

The effect of conductive fillers on electrical and adhesion properties of electrically conductive adhesives (ECAs) has been investigated. The ECAs were prepared by incorporating different conductive fillers such as silver (Ag), silver-coated copper (AgCu), and graphene into epoxy binder. At constant filler concentration, the Ag-filled ECAs exhibited the lowest bulk resistivity at around 3.6x10(-4) Omega. cm as compared to the ECAs filled with Ag/AgCu and Ag/AgCu/ graphene. Adhesion strength between silicon die and metallic lead frame showed systematic drop upon addition of graphene. Under 85 degrees C and 85% humidity environment, the bulk resistivity of the Ag/AgCu and Ag/AgCu/graphenefilled ECAs decreased with aging time due to the increase of crosslink density while the Ag-filled ECAs remained stable. Adhesion strength decreased with aging time.