▎ 摘　　要

Thermal metamaterials have recently attracted extensive attention for capable of manipulating heat flux, which makes it a great application potential in the field of electronic devices. However, developing a ther-mal manipulation device with facilely fabrication remains challenging as according to the theory of trans-formation thermotics, it not only needs to judiciously design and precisely distribute multiple materials with distinct thermal conductivity ( k ), but also should strictly match the background material. Herein, a facile fast-printed UV laser process is proposed to fabricate high-resolution laser induced graphene (LIG) patterns with controllable thermal conductivity enabling directional thermal manipulation-two types of thermal meta-devices, thermal cloak and concentrator. Effective anisotropic thermal conductivities are achieved by alternately assembling multilayer LIG films with polyimide (PI) layers. To obtain the optimal design of the LIG based meta-devices, the effects of k of the LIG, width ratio r , the number of layers n , and the overall size on thermal manipulation are theoretically simulated. The film thickness and k of LIG under different laser parameters were explored, and it was found that the film with a suitable laser power and a smaller thickness expansion can achieve a higher k . Besides, the thermal profiles of LIG -based meta-devices are experimentally demonstrated with varying laser powers and scanning speeds. The experiment result shows that the LIG-based multilayer cloak and bilayer cloak exhibit temperature gradients as low as 0.18 and 0.169 K/mm at the center of cloaks, with k of 8.96 and 13.05 W m( -1) K (-1), re-spectively. Additionally, a method of sputtering a layer of Cu film on the surface of the LIG based thermal concentrator to improve its thermal conductivity has also been evaluated. More importantly, LIG films feature with a thermal conductivity tunable, high-resolution, cost-effective, rapidly and facilely fabrica-tion method. The fast-printed LIG periodic multilayered structures construct a new thermal metamaterial that provides a viable approach to the thermal manipulation in electronic devices. (C) 2022 Elsevier Ltd. All rights reserved.