▎ 摘　　要

Recent years have witnessed a staggering escalation in the power density of modern electronic devices. Because increasingly high power density accumulates heat, efficient heat removal has become a critical limitation for the performance, reliability, and further development of modern electronic devices. Thermal interface materials (TIMs) are widely employed between the two solid contact surfaces of heat sources and heat sinks to increase heat removal for electric devices. Composites of graphene and matrix materials are expected to be the most promising TIMs because of the remarkable thermal conductivity of graphene. Here, the recent research on the thermal properties of graphene filled polymer composite TIMs is reviewed. First, the composition of graphene filled polymer composite TIMs is introduced. Then, the synthetic methods for graphene filled polymer composite TIMs are primarily described. This study focuses on introducing the methods for improving and characterizing the thermal properties of graphene filled polymer composite TIMs. Furthermore, the challenges facing graphene filled poly-mer composite TIMs for thermal management applications in the modern electronic industry and the further progress required in this field are discussed.