• 文献标题:   Synchronously improved electromagnetic interference shielding and thermal conductivity for epoxy nanocomposites by constructing 3D copper nanowires/thermally annealed graphene aerogel framework
  • 文献类型:   Article
  • 作  者:   YANG XT, FAN SG, LI Y, GUO YQ, LI YG, RUAN KP, ZHANG SM, ZHANG JL, KONG J, GU JW
  • 作者关键词:   polymermatrix composites pmcs, thermal propertie, electron microscopy, casting
  • 出版物名称:   COMPOSITES PART AAPPLIED SCIENCE MANUFACTURING
  • ISSN:   1359-835X EI 1878-5840
  • 通讯作者地址:   Northwestern Polytech Univ
  • 被引频次:   128
  • DOI:   10.1016/j.compositesa.2019.105670
  • 出版年:   2020

▎ 摘  要

3D copper nanowires-thermally annealed graphene aerogel (CuNWs-TAGA) framework is firstly prepared by freeze-drying followed by thermal annealing from CuNWs, graphene oxide (GO) and L-ascorbic acid. Epoxy resin is then poured back into the above 3D CuNWs-TAGA framework to fabricate the CuNWs-TAGA/epoxy nanocomposites. CuNWs with average diameter of about 120 nm and length of approximate 10 gm are successfully prepared. When the mass fraction of CuNWs-TAGA is 7.2 wt% (6.0-1.2 wt% CuNWs-TAGA), the thermal conductivity coefficient (lambda) value of the CuNWs-TAGA/epoxy nanocomposites reaches the maximum of 0.51 W/mK. Meantime, the CuNWs-TAGA/epoxy nanocomposites exhibit the maximum electromagnetic interference shielding effectiveness (EMI SE) value of 47 dB and electrical conductivity (sigma) of 120.8 S/m, ascribed to perfect 3D CuNWs-TAGA conductive network structures. Meanwhile, the corresponding elasticity modulus, hardness, glass transition temperature (T-g) and heat-resistance index (T-HIR) of the CuNWs-TAGA/epoxy nanocomposites increase to 4.69 GPa, 0.33 GPa, 126.3 degrees C and 181.7 degrees C, respectively.