▎ 摘　　要

Recently, both heat dissipation and the electromagnetic wave generated from the devices have emerged as critical issues as semiconductor devices are getting miniaturized and integrated densely. Thermal and electrical conductive adhesives using graphene-Cu particle composite materials were fabricated. Graphene oxide (GO) was synthesized by using improved Hummer's method and it was reduced by hydrazine. The surfaces of Cu particles were functionalized by 2,2'-Bithiophene to form the self-assembled monolayers (SAMs). The SAMs not only provide a convenient means for preparing covalent bond with functional groups of reduced-GO (rGO), but also it can prevent oxidation. The experimental results were analyzed by using Raman Spectroscopy, Fourier Transform Infrared Spectroscopy, Digital-multimeter, C-Therm TCi Thermal conductivity Analyzer, X-ray Photoelectron Spectroscopy. Our experimental results demonstrate that the functionalized Cu (F-Cu) attached with rGO composites could be a possible substitute for commercialized fillers at present (e.g., Ag-coated copper fillers) because our new F-Cu+rGO composite filler in conducting adhesives is cheaper and lighter than those of Ag-coated Cu fillers.