• 文献标题:   Improved thermomechanical and electrical properties of reduced graphene oxide reinforced polyaniline - dodecylbenzenesulfonic acid/divinylbenzene nanocomposites
  • 文献类型:   Article
  • 作  者:   PATHAK AK, KUMAR V, SHARMA S, YOKOZEKI T, DHAKATE SR
  • 作者关键词:   reduced graphene oxide, polyaniline, nanocomposite, mechanical propertie, thermal propertie, interfacial propertie
  • 出版物名称:   JOURNAL OF COLLOID INTERFACE SCIENCE
  • ISSN:   0021-9797 EI 1095-7103
  • 通讯作者地址:   CSIR
  • 被引频次:   14
  • DOI:   10.1016/j.jcis.2018.08.105
  • 出版年:   2019

▎ 摘  要

Hypothesis: Various efforts are going on to improve the electrical properties of carbon fiber reinforced polymer (CFRP) composites. Conducting polymer is one the promising material to achieve the desired electrical properties of CFRP composites without compromising the mechanical properties as a lighting sticking material. Experiments: In present study, in addition to conducting polymer polyaniline (PANT), another conducting phase reduced graphene oxide (RGO) was incorporated in PANT based system. The RGO was synthesized and incorporated in different weight (0-0.5 wt%) fraction in dodecylbenzenesulfonic acid (DBSA) doped PANI-divinylbenzene (DVB) polymer to get PANI-DBSA/DVB nanocomposite. The mechanical and interfacial interaction was analyzed by universal testing machine (UTM) and transmitted electron microscopy (TEM). Findings: The addition of optimum 0.3 wt% RGO improved flexural strength and modulus of PANI-DSBA/RGO-DVB composite by 153% and 32% respectively over neat PANI-DBSA/DVB nanocomposite. The maximum electrical conductivity 0.301 S/cm, glass transition temperature (T-g) and thermal stability of nanocomposite realized at 0.3 wt% of RGO. Raman spectroscopy and HRTEM confirmed the improvement of interfacial bonding by H-bonding and pi-pi interaction. For the 1st time we are reporting RGO utilisation for the improvement of thermomechanical and electrical interfacial properties of PANI-DBSA/DVB nanocomposite for the structural applications. (C) 2018 Elsevier Inc. All rights reserved.