▎ 摘　　要

Graphene mixed with epoxy for thermal interface material (TIM) has been well researched. However, some issues emerge when epoxy is used as matrix material, such as overflow problem, non-uniform thickness, needing solidification time, etc. In order to avoid the above issues, a new high performance phase change material (PCM) is prepared by incorporating graphene with polyolefin hot melt pressure sensitive adhesive (HMPSA). The thermal conductivity and hardness of graphene/HMPSA (GHMPSA) composites are both measured and found to be increased with the increase of filled graphene. Due to the increasing hardness, the smallest thermal contact resistance is achieved with 6 wt.% graphene, not 10 wa, even the biggest thermal conductivity of GHMPSA is 5.6 W/(mK) with 10 wt.% graphene. The comparison between the present GHMPSA TIM and other commercial TIMs indicates that the present GHMPSA composite is a commendable TIM in reducing thermal contact resistance. (C) 2015 Elsevier Ltd. All rights reserved.