• 文献标题:   Enhancement of Thermal Conductivity and Mechanical Properties of Cu-Reduced Graphene Oxide Composites by Interface Modification
  • 文献类型:   Article
  • 作  者:   ZHANG X, WAN DQ, PENG K, ZHANG W
  • 作者关键词:   copper matrix, graphene, interfacial bonding, mechanical propertie, thermal conductivity
  • 出版物名称:   JOURNAL OF MATERIALS ENGINEERING PERFORMANCE
  • ISSN:   1059-9495 EI 1544-1024
  • 通讯作者地址:   Hunan Univ
  • 被引频次:   2
  • DOI:   10.1007/s11665-019-04212-x
  • 出版年:   2019

▎ 摘  要

Copper matrix composites reinforced with reduced graphene oxide (rGO) were fabricated via charge adsorption process, thermal reduction, and hot-press sintering process. We investigated the effect of rGO on the thermal conductivity, electrical conductivity, mechanical properties, and microstructure of the composites. By controlling the reaction process, copper on the rGO surface was oxidized to form Cu2O. The presence of Cu2O at the interface enhanced interfacial bonding strength and reduced the interfacial thermal resistance, thus improving the thermal conductivity and mechanical properties. This enhancement occurred at low rGO contents. By contrast, excessive amounts led to rGO agglomeration and a degradation of the performance. At the optimum rGO content of 0.6 wt.%, the composites had a 10% increase in thermal conductivity and a 46% increase in yield strength (sigma(0.2)), while maintaining high electrical conductivity.