▎ 摘　　要

The integration and miniaturization of chips lead to inevitable overheating and increasing electromagnetic interference (EMI) problems, which threaten the performance, stability, and lifetime of electronic components. Therefore, it is important to improve the heat dissipation and EMI shielding performance in device packaging for the steady operation of electronic products. In recent years, due to its intrinsic superior thermal conductivity, proper electrical conductivity, light-weight, and structural adjustability, graphene has been widely used as high thermal and conductive fillers incorporated in the polymer matrix to improve the thermal conductivity and electrical conductivity of composites. This review concludes the recent development of graphene/polymer composites by using graphene as fillers to improve the thermal conductivity and EMI shielding effectiveness (EMI SE). The structure of graphene embedded in the composites varies from zero-dimension (0D), one-dimension (1D) to two-dimensions (2D). Moreover, highly thermally and electrically conductive fillers with different dimensions were also modified on the graphene to improve the composite performance. Finally, this review also makes prospects for the development trend of graphene/polymer composites with high thermal conductivity and EMI SE in the future. (c) 2022 Published by Elsevier Ltd on behalf of The editorial office of Journal of Materials Science & Technology.