• 文献标题:   Temperature Sensitivity of Electrical Resistivity of Graphene/Copper Hybrid Nano Ribbon Interconnect: A First Principle Study
  • 文献类型:   Article
  • 作  者:   MOHSIN KM, SRIVASTAVA A, SHARMA AK, MAYBERRY C, FAHAD MS
  • 作者关键词:  
  • 出版物名称:   ECS JOURNAL OF SOLID STATE SCIENCE TECHNOLOGY
  • ISSN:   2162-8769
  • 通讯作者地址:   Louisiana State Univ
  • 被引频次:   6
  • DOI:   10.1149/2.0071704jss
  • 出版年:   2017

▎ 摘  要

Recent studies have shown superior thermal transport of graphene on copper as a potential candidate for the next generation interconnects. Using density function theory (DFT) we have studied the current transport of graphene/copper (G/Cu) hybrid-nano wire interconnect system and compared electrical characteristics with other two dimensional counterparts along with graphene. From the first principle calculation, band structure and density of states have been calculated. Using Landauer-Buttiker (LB) formalism, electrical transport is calculated. We explained why G/Cu hybrid interconnect shows more conductivity than graphene only interconnects with the help of phase space argument. As graphene on copper system has more available density of states near the Fermi level it offers more states than graphene for conduction. (C) The Author(s) 2017. Published by ECS. All rights reserved.