• 文献标题:   Enhanced thermal resistance of phenolic resin composites at low loading of graphene oxide
  • 文献类型:   Article
  • 作  者:   SI JJ, LI J, WANG SJ, LI Y, JING XL
  • 作者关键词:   polymermatrix composites pmcs, thermal propertie, thermal analysi, thermosetting resin
  • 出版物名称:   COMPOSITES PART AAPPLIED SCIENCE MANUFACTURING
  • ISSN:   1359-835X EI 1878-5840
  • 通讯作者地址:   Xi An Jiao Tong Univ
  • 被引频次:   36
  • DOI:   10.1016/j.compositesa.2013.07.019
  • 出版年:   2013

▎ 摘  要

By incorporating graphene oxide (GO) into phenolic resin (PR), GO/PR composites were prepared, and the effects of the content and reduction degree of GO on thermal resistance of GO/PR composites were studied. The peak degradation temperature of the PR was increased by about 14 degrees C with GO which was heat treated. The char yield of GO/PR composite at a GO weight fraction of 0.5% was about 11% greater than that of PR. The interactions such as covalent bonds and pi-pi stacking between GO and PR were regarded as the main reason for the enhancement. Located at the GO-PR interface, GO effectively anchored and structured PR molecular near the surfaces of GO sheets, and thus facilitated the formation of char. The superiority of GO/PR composites over PR in terms of thermal properties enhancement should also be related to the promoting graphitization by the addition of GO. (C) 2013 Elsevier Ltd. All rights reserved.